US Patent Issued to NITTO DENKO on Oct. 21 for "Method for producing wiring circuit board and wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,013, issued on Oct. 21, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Method for producing wiring circuit board and wiring circuit board" was invented by Kenta Fukushima (Osaka, Japan), Hayato Takakura (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Ryosuke Sasaoka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thi...