US Patent Issued to NITTO DENKO on Nov. 4 for "Wiring circuit board and method of producing the wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,642, issued on Nov. 4, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and method of producing the wiring circuit board" was invented by Takahiro Ikeda (Osaka, Japan), Kyotaro Yamada (Osaka, Japan), Taketo Ishikawa (Osaka, Japan), Hironori Kuwayama (Osaka, Japan) and Yuki Takeda (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer th...