ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,424, issued on May 27, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Kenya Takimoto (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Hayato Takakura (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residua...