ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,499, issued on March 25, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).
"Peeling method" was invented by Yosuke Shimizu (Ibaraki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a method for peeling an adherend from a pressure-sensitive adhesive layer by irradiating a laminate in which the pressure-sensitive adhesive layer and the adherend are laminated with light, the peeling method includes a step of irradiating the pressure-sensitive adhesive layer with the light having a pulse width of 1 second or less and a light irradiation amount of 1,000 mJ/cm2 or more, and the pressure-sensitive adhesive layer satisfies p...