US Patent Issued to NITTO DENKO on July 22 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,247, issued on July 22, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board" was invented by Hideki Matsui (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Ryosuke Sasaoka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes ...