ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,431, issued on Jan. 27, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Producing method of wired circuit board" was invented by Hayato Takakura (Osaka, Japan), Yasunari Oyabu (Osaka, Japan) and Naoki Shibata (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that t...