US Patent Issued to NITTO DENKO on Feb. 11 for "Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,221,571, issued on Feb. 11, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet" was invented by Shuhei Yamamoto (Osaka, Japan) and Amane Sawamura (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure-sensitive adhesive layer consists of a dried product of a water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition contains a water-dispersible polymer, water, and polyacrylic acid. The polyacrylic acid content is above 0.1 parts by mass and 7 parts by mass or less with respect to 100 parts by mass of the wa...