US Patent Issued to NITTO DENKO on April 29 for "Wiring circuit board and wiring circuit board assembly" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,830, issued on April 29, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and wiring circuit board assembly" was invented by Hayato Takakura (Osaka, Japan), Naoki Shibata (Osaka, Japan), Kenya Takimoto (Osaka, Japan) and Chihiro Watanabe (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting l...