ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,757, issued on April 22, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Shusaku Shibata (Osaka, Japan), Hiroaki Machitani (Osaka, Japan) and Teppei Niino (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in th...