US Patent Issued to NITTO DENKO on April 15 for "Wiring circuit board and producing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,367, issued on April 15, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and producing method thereof" was invented by Rihito Fukushima (Osaka, Japan), Hayato Takakura (Osaka, Japan) and Naoki Shibata (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connect...