US Patent Issued to NITTA DUPONT on Oct. 7 for "Polishing composition and method of polishing silicon wafer" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,244, issued on Oct. 7, was assigned to NITTA DUPONT Inc. (Osaka, Japan).

"Polishing composition and method of polishing silicon wafer" was invented by Noriaki Sugita (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing composition is provided that can reduce micro-defects on a semiconductor wafer after polishing. A polishing composition includes: an abrasive; a basic compound; a wetting agent; and a non-ionic surfactant, where the surface tension Yud is not higher than 64 mN/m, and the ratio of the surface tension after dilution with water by a factor of 20, Yd, to the surface tension Yud, denoted by Yd/Yud, is not lower than 1.10...