ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,411, issued on June 17, was assigned to NITERRA Co. LTD. (Nagoya, Japan).
"Semiconductor package" was invented by Kenji Obinata (Nagoya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate body made of an insulating material and having a frame shape with a through hole; and a heat-dissipating member made of a metallic material and having a top face serving as an element-mounting surface, the element-mounting surface being positioned in the through hole. A back face of the substrate body and a front face of the heat-dissipating member are joined to each other with a joining agent, the back face being orie...