US Patent Issued to NITERRA on Jan. 13 for "Wiring substrate and method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,918, issued on Jan. 13, was assigned to NITERRA Co. LTD. (Nagoya, Japan).

"Wiring substrate and method for manufacturing wiring substrate" was invented by Jyunya Matsura (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a ceramic substrate, a thin-film resistor disposed on the ceramic substrate, a first resin layer formed of a resin and disposed in a region on the ceramic substrate where the resistor is not disposed, and a second resin layer formed of a resin and covering the resistor on the ceramic substrate."

The patent was filed on Aug. 30, 2023, under Application No. 18/458,472.

*For further information,...