US Patent Issued to Nissha on July 22 for "Electronic component-equipped resin casing and method for producing same" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,987, issued on July 22, was assigned to Nissha Co. Ltd. (Kyoto, Japan).

"Electronic component-equipped resin casing and method for producing same" was invented by Chuzo Taniguchi (Kyoto, Japan), Jun Sasaki (Kyoto, Japan), Eiji Kawashima (Kyoto, Japan) and Yasuisa Takinishi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opp...