ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,381, issued on May 13, was assigned to NISSAN CHEMICAL Corp. (Tokyo).

"Laminate, release agent composition, and method for manufacturing processed semiconductor substrate" was invented by Masaki Yanai (Toyama, Japan), Takahisa Okuno (Toyama, Japan), Hiroto Ogata (Toyama, Japan) and Shunsuke Moriya (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate having a semiconductor substrate, a UV-ray-transmissive support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate. The release layer is a film formed from a releasing agent composition containing a polymer of an...