ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,227,678, issued on Feb. 18, was assigned to NISSAN CHEMICAL Corp. (Tokyo).
"Laminate peeling method, laminate, and laminate production method" was invented by Kazuhiro Sawada (Toyama, Japan), Shunsuke Moriya (Toyama, Japan) and Tetsuya Shinjo (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second s...