ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,668, issued on June 3, was assigned to NIPPON TELEGRAPH AND TELEPHONE Corp. (Tokyo).
"Package and manufacturing method of the same" was invented by Hiromasa Tanobe (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first frame includes portions of a first short side surface and a first long side surface, in which a plurality of conductor layers to which a plurality of DC electrode terminals are connected, and a plurality of insulating layers arranged between the plurality of conductor layers are stacked. Further, a second frame includes portions of a second short side surface and a second long side surface."
The patent was filed on Aug. 3, 2020...