ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,567, issued on April 8, was assigned to NIPPON TELEGRAPH AND TELEPHONE Corp. (Tokyo).

"Manufacturing method for high-frequency package" was invented by Hiromasa Tanobe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes adjusting an interval between a linear portion of a first lead and a second lead using a lead shape changing jig. The interval between the linear portion of the first lead and the second lead is adjusted after a distal end portion of a first lead of a first lead frame is connected to a first signal pad and after a distal end portion of a second lead is connected to a second signal pad."

The patent was filed on Ju...