ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,096, issued on June 17, was assigned to NIPPON PILLAR PACKING Co. LTD. (Osaka, Japan).
"Dielectric, copper clad laminate, circuit board, method for manufacturing copper clad laminate" was invented by Manami Noda (Osaka, Japan), Naozumi Fukushima (Osaka, Japan) and Takeshi Okunaga (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To improve electric characteristics of a dielectric for use for a high frequency band.A dielectric 2 formed by lamination of fluorine resin includes a base main layer 3b containing a base material 3a and made of melting fluorine resin, a pair of base cover layers 3c made of melting fluorine resin and formed on bot...