ALEXANDRIA, Va., June 10 -- United States Patent no. 12,290,883, issued on May 6, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan).
"Bonding wire" was invented by Daizo Oda (Saitama, Japan), Motoki Eto (Saitama, Japan) and Ryo Oishi (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a novel alloy-coated Cu bonding wire that achieves a favorable FAB shape and also a favorable initial bondability of a 2nd bonding part including adhesion of the 2nd bonding part, and that reduces a galvanic corrosion in a high-temperature environment to achieve a favorable bond reliability of the 2nd bonding part. The alloy-coated Cu bonding wire includes a core material of Cu or Cu alloy, a...