US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL Chemical & Material on Nov. 4 for "Copper bonding wire for semiconductor devices and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,171, issued on Nov. 4, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).

"Copper bonding wire for semiconductor devices and semiconductor device" was invented by Ryo Oishi (Saitama, Japan), Daizo Oda (Saitama, Japan), Noritoshi Araki (Saitama, Japan), Kota Shimomura (Saitama, Japan), Tomohiro Uno (Tokyo) and Tetsuya Oyamada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a copper bonding wire having an improved storage life in the atmosphere. There is specifically provided a copper bonding wire for semiconductor devices characterized in that a density of crystal gra...