US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL CHEMICAL & MATERIAL on May 13 for "Copper alloy bonding wire for semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,658, issued on May 13, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL CHEMICAL & MATERIAL Co. LTD. (Tokyo).

"Copper alloy bonding wire for semiconductor devices" was invented by Daizo Oda (Saitama, Japan), Takashi Yamada (Saitama, Japan), Motoki Eto (Saitama, Japan), Teruo Haibara (Saitama, Japan) and Tomohiro Uno (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or ...