ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,467, issued on June 17, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).
"Copper bonding wire" was invented by Tomohiro Uno (Tokyo), Tetsuya Oyamada (Tokyo), Daizo Oda (Saitama, Japan), Kota Shimomura (Saitama, Japan) and Tadashi Yamaguchi (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a copper bonding wire that exhibits a favorable bondability even when a scrub at the time of bonding is reduced. The copper bonding wire is characterized in that when a sum of percentages of Cu, Cu2O, CuO and Cu(OH)2 on a surface of the wire as measured by X-ray Photoelect...