US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL Chemical & Material on Aug. 12 for "Al bonding wire" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,044, issued on Aug. 12, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).

"Al bonding wire" was invented by Takashi Yamada (Saitama, Japan), Akihito Nishibayashi (Saitama, Japan), Teruo Haibara (Saitama, Japan), Daizo Oda (Saitama, Japan), Motoki Eto (Saitama, Japan), Tetsuya Oyamada (Tokyo), Takayuki Kobayashi (Tokyo) and Tomohiro Uno (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided an Al bonding wire which can achieve a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the Al bondin...