US Patent Issued to Nippon Kayaku on Dec. 2 for "Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,371, issued on Dec. 2, was assigned to Nippon Kayaku K.K. (Tokyo).

"Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device" was invented by Kazuyoshi Yamamoto (Tokyo), Takahumi Mizuguchi (Tokyo), Eri Yoshizawa (Tokyo) and Mao Takeda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermally curable resin composition which can give cured objects having low-dielectric characteristics, high heat resistance, a low modulus, and a low water absorption and which has satisfactor...