ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,340, issued on Sept. 16, was assigned to NIPPON DENKAI LTD. (Tokyo).
"Surface-treated copper foil" was invented by Yasuhiro Endo (Chikusei, Japan), Shota Moroe (Chikusei, Japan) and Sayaka Kinoshita (Chikusei, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A surface-treated copper foil which maintains peel strength against the resin substrate of the surface-treated copper foil and achieves desired low transmission loss even at high frequencies includes an electrolytic copper foil, at least one roughened layer that covers one surface of the electrolytic copper foil, an anti-rust layer that covers the at least one roughened layer, and a silane ...