US Patent Issued to NIPPON CHEMICAL INDUSTRIAL on May 13 for "Negative thermal expansion material, method for producing the same, and composite material" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,123, issued on May 13, was assigned to NIPPON CHEMICAL INDUSTRIAL Co. LTD. (Tokyo).

"Negative thermal expansion material, method for producing the same, and composite material" was invented by Junya Fukazawa (Tokyo), Takuma Kato (Tokyo) and Toru Hata (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms and represented by the following general formula (1), CuxMyVzOt (1). In g...