US Patent Issued to NIO TECHNOLOGY (ANHUI) on Oct. 28 for "Thermal transfer device for electronic processors" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,709, issued on Oct. 28, was assigned to NIO TECHNOLOGY (ANHUI) Co. LTD. (Hefei, China).

"Thermal transfer device for electronic processors" was invented by Tseng-Mau Yang (South Lake Tahoe, Calif.), Bradley J. Angier (Santa Cruz, Calif.), Waylon Y. Chen (San Jose, Calif.), Paul Alan Zahorsky (Santa Cruz, Calif.) and Karl Yngve Johnson (Felton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly includes a condenser plate, a plurality of pads and one or more heat-pipes. The condenser plate includes a plurality of apertures. Each of the plurality of apertures overlaps a location of a corresponding one of a plurality of integrated circuit...