US Patent Issued to NINGBO SUNNY OPOTECH on Sept. 23 for "Photosensitive assembly and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,395, issued on Sept. 23, was assigned to NINGBO SUNNY OPOTECH Co. LTD. (Yuyao, China).

"Photosensitive assembly and manufacturing method thereof" was invented by Wenjie Wang (Yuyao, China), Mingzhu Wang (Yuyao, China) and Zhenyu Chen (Yuyao, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic...