US Patent Issued to NINGBO SUNNY OPOTECH on May 13 for "Manufacturing method of a molded photosensitive assembly for an array imaging module" (Chinese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,533, issued on May 13, was assigned to NINGBO SUNNY OPOTECH Co. LTD. (Zhejiang, China).

"Manufacturing method of a molded photosensitive assembly for an array imaging module" was invented by Mingzhu Wang (Ningbo, China), Bojie Zhao (Ningbo, China), Takehiko Tanaka (Ningbo, China), Nan Guo (Ningbo, China), Zhenyu Chen (Ningbo, China), Heng Jiang (Ningbo, China), Zhongyu Luan (Ningbo, China), Fengsheng Xi (Ningbo, China), Feifan Chen (Zhejiang, China) and Liang Ding (Ningbo, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at...