ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,039, issued on July 15, was assigned to NINGBO SUNNY OPOTECH Co. LTD. (Zhejiang, China).
"Photosensitive assembly, camera module and manufacturing methods therefor" was invented by Zhongyu Luan (Zhejiang, China), Zhen Huang (Zhejiang, China), Li Liu (Zhejiang, China), Xinxiang Sun (Zhejiang, China) and Bin Lu (Zhejiang, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on ...