US Patent Issued to Ningbo Semiconductor International Corporation (Shanghai Branch) on Dec. 23 for "Packaging module and packaging method of BAW resonator" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,458, issued on Dec. 23, was assigned to Ningbo Semiconductor International Corporation (Shanghai Branch) (Shanghai).

"Packaging module and packaging method of BAW resonator" was invented by Hailong Luo (Ningbo, China) and Fei Qi (Ningbo, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a packaging module and packaging method of a BAW resonator. The packaging method includes: bonding a BAW resonant device including a first substrate and a resonant structure provided on the first substrate to a second substrate through a bonding layer; forming through holes exposing corresponding electrical connection portions of th...