ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,728, issued on Oct. 21, was assigned to Nikon Corp. (Tokyo).
"Bonding method and bonding device" was invented by Yoshihiro Maehara (Tokyo), Atsushi Kamashita (Tokyo), Hajime Mitsuishi (Tokyo) and Minoru Fukuda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of t...