ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,930, issued on Aug. 26, was assigned to NIKO SEMICONDUCTOR Co. LTD. (New Taipei, Taiwan).
"Power module package" was invented by Hui-Chiang Yang (Taipei Hsien, Taiwan), Chung-Ming Leng (New Taipei, Taiwan), Chih-Cheng Hsieh (Taoyuan, Taiwan) and Wei-Lun Wang (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are resp...