ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,822, issued on Jan. 13, was assigned to NIHON SUPERIOR Co. LTD. (Osaka, Japan).
"Sn solder paste comprising cu-co metal particles" was invented by Tetsuro Nishimura (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu-Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, an...