ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,501, issued on Aug. 5, was assigned to NIHON SUPERIOR Co. LTD. (Osaka, Japan).
"Solder preform containing Cu-Co particles" was invented by Tetsuro Nishimura (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when ...