ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,417, issued on Dec. 30, was assigned to NIHON KOHDEN Corp. (Tokyo).

"Thermosensitive probe" was invented by Hironori Sugawara (Tokorozawa, Japan), Hiroshi Kubo (Tokorozawa, Japan), Kohei Otaka (Tokorozawa, Japan) and Takuma Sano (Tokorozawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermosensitive probe includes: a non-metallic thermoconductive member defining a housing space; a thermosensitive element disposed in the housing space; and a coupling member having a portion surrounding the thermosensitive element in the housing space while fixing the thermosensitive element to the thermoconductive member."

The patent was filed on Nov. 27...