ALEXANDRIA, Va., Nov. 6 -- United States Patent no. D1,100,684, issued on Nov. 4, was assigned to NIHON DEMPA KOGYO Co. LTD. (Tokyo).
"Sensor module" was invented by Hiroyuki Kukita (Saitama, Japan).
The patent was filed on May 17, 2024, under Application No. D/942,814.
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