ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,869, issued on July 15, was assigned to NIDEC CHAUN-CHOUNGTECHNOLOGY Corp. (New Taipei, Taiwan).
"Heat dissipation device" was invented by Abbas Ali (New Taipei, Taiwan), Bin-Wei Goh (New Taipei, Taiwan) and Shao-Chien Lu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device with a heat-insulating channel includes a thermal conductive substrate, multiple heat dissipation fins stacked with spacing from one another on the thermal conductive substrate, and at least one insulation guiding component. The heat dissipation fins have at least one configuration space for the insulation guiding component to be installed,...