US Patent Issued to NICHIA on Oct. 21 for "Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,528, issued on Oct. 21, was assigned to NICHIA Corp. (Anan, Japan).

"Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module" was invented by Teppei Kunimune (Tokushima, Japan) and Masafumi Kuramoto (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material...