US Patent Issued to NICHIA on May 27 for "Method of manufacturing light emitting device and light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,663, issued on May 27, was assigned to NICHIA Corp. (Anan, Japan).

"Method of manufacturing light emitting device and light emitting device" was invented by Daisuke Sanga (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such th...