US Patent Issued to NICHIA on May 27 for "Light emitting module manufacturing method including covering lateral faces of light emitting elements with resin" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,661, issued on May 27, was assigned to NICHIA Corp. (Anan, Japan).

"Light emitting module manufacturing method including covering lateral faces of light emitting elements with resin" was invented by Koji Abe (Tokushima, Japan) and Kazusa Nishiuchi (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contain...