US Patent Issued to NICHIA on May 13 for "Method of manufacturing semiconductor element and semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,547, issued on May 13, was assigned to NICHIA Corp. (Anan, Japan).

"Method of manufacturing semiconductor element and semiconductor element" was invented by Kazuki Yamaguchi (Tokushima, Japan) and Yoshitaka Sumitomo (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor element includes: a substrate having a first surface, a second surface, and at least one lateral surface; and a semiconductor layer formed on the second surface. The at least one lateral surface includes: at least one flat region, a first region that extends along a first direction parallel to the first surface at a position apart from the first surface and ...