US Patent Issued to NICHIA on March 4 for "Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,796, issued on March 4, was assigned to NICHIA Corp. (Anan, Japan).

"Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion" was invented by Tadaaki Miyata (Yokohama, Japan), Yoshihiro Kimura (Yokohama, Japan) and Masatoshi Nakagaki (Komatsushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount includ...