US Patent Issued to NICHIA on March 25 for "Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,090, issued on March 25, was assigned to NICHIA Corp. (Anan, Japan).

"Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate" was invented by Masatsugu Ichikawa (Tokushima, Japan), Shoichi Yamada (Anan, Japan), Takeshi Kihara (Tokushima, Japan) and Yutaka Matsusaka (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface,...