US Patent Issued to NICHIA on June 3 for "Light emitting device package having lead electrode with varying height" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,283, issued on June 3, was assigned to NICHIA Corp. (Anan, Japan).

"Light emitting device package having lead electrode with varying height" was invented by Koji Abe (Tokushima, Japan) and Yuki Shiota (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for mounting a light emitting element includes: a first lead electrode defining a portion of a bottom of a recess and comprising a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view: a first region, a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the...