US Patent Issued to NICHIA on July 29 for "Device manufacturing method and light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,654, issued on July 29, was assigned to NICHIA Corp. (Anan, Japan).

"Device manufacturing method and light emitting device" was invented by Tomokazu Sakata (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device manufacturing method includes: applying a bonding material in a predetermined position on a mounting face of a base by dispensing the bonding material through a nozzle of a bonding machine, in which an outline of a leading end face of the nozzle defines an area of at least 75% of a bonding face of a component to be mounted, so that the bonding material applied onto the mounting face has an outline that at least partially extends...