US Patent Issued to NICHIA on July 1 for "Light emitting module and method for manufacturing light emitting module" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,525, issued on July 1, was assigned to NICHIA Corp. (Anan, Japan).

"Light emitting module and method for manufacturing light emitting module" was invented by Kensuke Yamaoka (Tokushima, Japan) and Daisuke Sanga (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a secon...