US Patent Issued to NICHIA on Jan. 28 for "Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,959, issued on Jan. 28, was assigned to NICHIA Corp. (Anan, Japan).

"Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body" was invented by Hirofumi Ichikawa (Komatsushima, Japan), Masaki Hayashi (Anan, Japan), Shimpei Sasaoka (Tokushima, Japan) and Tomohide Miki (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upp...