US Patent Issued to NICHIA on Feb. 18 for "Compound for bonded magnet, bonded magnet, method of producing same, and resin composition for bonded magnets" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,438, issued on Feb. 18, was assigned to NICHIA Corp. (Anan, Japan).

"Compound for bonded magnet, bonded magnet, method of producing same, and resin composition for bonded magnets" was invented by Satoshi Yamanaka (Tokushima, Japan), Takayuki Yano (Tokushima, Japan), Shuichi Tada (Komatsushima, Japan), Masahiro Abe (Tokushima, Japan) and Kenta Iwai (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a compound for bonded magnets, the method including: heat-curing a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetti...